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Fine Pitch Process

  • 01

    The fine pitch wire bonding of 18um wire can be realized.

  • 02

    Can use gold wire、alloy wire and copper wire for quantitative production.

  • 03

    The aluminum pad wire bonding center has a minimum distance of 60um.

  • 04

    The minimum bonding ball can be 50um.

  • 05

    The minimum thickness of aluminum is 0.6um.

Multi-chip Packaging process

  • 01

    Multiple chip package can be realized.

  • 02

    Realize system-level modular integration.

  • 03

    The combination of high density,high performance, high reliability and three-dimensional structure, including components, components, subsystems and systems.

  • 04

    To realize the integration of semiconductor device and whole machine system.

  • 05

    It saves the area of the board and provides the conditions for the realization of the large-scale control circuit.

3D Module Packaging Process

  • 01

    Multi-layer chips can be superimposed.

  • 02

    Realize the integration of system level modules.

  • 03

    It can realize high density, high reliability, high performance and high capacity storage circuit system.

  • 04

    The function and application of unit volume are multiplied.

  • 05

    The minimum bonding ball can be 50um.

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